Version History – Developer

10.17.11

Improved: Revision Manager

  • added 4 reports to the ICT Access Pads reports group: Missing TestPads Top, Missing TestPads Bottom, Shifted TestPads Top, Shifted TestPads Bottom

Improved: DFT Analysis

  • added 1 report to the ICT Access Pads report group: Insufficient CB Edge Separation Pads; this is determined by the value set for the ‘Min Test Pad To Board Edge’ property in DFT Settings; pads that fail this rule are labeled CB EDGE SEP in the ICT Access property for the pad
  • modified ‘Print Probed Pads Access Report’ to be automatically set to ‘Include No Connect’ if any NC Nets have probes; added option to 1) List All Pads, 2) List DFT Access Pads Only and 3) List Probed Pads Only

Improved: Probes Placement

  • added new rule to the Probe Separation Rules table: ‘Probe Center To CB Edge >=’; this rule is the same for all probe sizes; if this value is non-zero, pads that are closer to the circuit board edge than the value are not considered for probe placement; if the value is zero, this rule is ignored

Improved: CAD Import – IPC2581

  • modified Name extraction utility to extract the proper name from name attributes containing embedded colons

10.17.9

Improved: CAD Import – Altium PCBDOC

  • modified CAD import to rename parts when a TEXT Record has a COMPONENT reference with a DESIGNATOR=True property value

Improved: Agilent (Keysight) 3070 Test Programmer

  • added Current Version pull down option to the Versions tab
  • added Current Version and Included Versions to the Board file header

10.17.8

Improved: CAD Import – Altium PCBDOC

  • fixed bug that caused the board outline to be sized incorrectly if no outline is included in the CAD file

Improved: Package Library Merging

  • fixed bug that caused pad access to not be modified as package sizes where adjusted from the library

10.17.7

Improved: CAD Import – ODB++

  • fixed bug that caused the source directory files to be deleted if errors occurred during load

10.17.6

Improved: CAD Import – ODB++

  • added filtering to compensate for variations in the NET listing in the EDA file; previously, the variations resulted in Nets not being assigned to pads and traces

Improved: Developer GUI – Probe Keepout Areas

  • added an area fill to the Probe Keepout areas around parts, so as to make it easier to see when areas overlap

10.17.5

Improved: CAD Import – ODB++

  • added filtering to compensate for improper bottom layer stacking in the Matrix file

Improved: Developer GUI

  • modified layer sort to include Paste Mask (PM) and Solder Mask (SM) layers in the Top and Bottom side listing of the Legend and Conductive layers; the order of listing on the top side is LG (Legend), PM, SM and CD (Conductor); on the bottom side the order is reversed, e.g., CD, SM, PM, and LG

10.17.4

Improved: CAD Import – ODB++

  • fixed bug caused when ODB assigned a file as DRILL but not in the BOARD context

Improved: Agilent (Keysight) AOI Test Programmer

  • added filter to eliminate an error caused when the CAD data contains single pad defined nets without a part-pin

Improved: CAD Import – Allegro Multi-File

  • fixed bug that caused missing NC pins when no pin name was included in the Pin Definition line for the Rte file; now pins that have no name will be automatically included and will use the naming convention NC_PartName_PinNumber

Improved: CAD Import – IPC2581

  • improved the handling of Panels in loading multiple steps in the 2581 file

Improved: CAD Import – GenCAD

  • modified TestPins input to set the Probe Number to the number value of a Probe Name like F123; this will result in a Probe Number of 123

Improved: CAD Import – Pads Power PCB

  • modified parser to add internal traces that were missing in some cases

Improved: BOM Import

  • fixed bug that caused new part numbers to not be saved to the BASE version

10.17.3

Improved: ODB++ CAD Import

  • fixed “object variable not set” bug

Improved: Agilent (Keysight) AOI Test Programmer

  • added selection to ‘Exclude Non-Populated Parts’ based on the current version

10.17.1

Improved: ODB++ CAD Import

  • fixed Subscript Out Of Range bug when loading certain files

Improved: DFT Analysis

  • added to the Probes tab the report ‘Probing Masked Or Relief Pads’; this report lists all pads that are masked or have insufficient relief openings and are probed; it is used to provide specific guidance to the CAD designer as to pads that should have the relief opened or enlarged by using Developer’s Probes Placement functionality to specifically target these pad types
  • added to the Probes tab the report ‘Print Probed Masked and Undersized Pads Report’; this report lists all probes hitting either masked pads, insufficient relief pads, and undersized pads; it is useful in generating a specific report for the CAD designer that lists only those pads that need modification based on actual probe placements done using Developer’s Probes Placement functionality; Probes Placement Macros, set to target pads that can be modified in size or masking to be ICT accessible, can resolve all the spacing, probe sizing, and other issues that determine if a pad is actually a candidate for ICT access

10.16.27

Improved: Takaya Flying Probe Test Programmer

  • fixed bug that caused application crash when working with boards with extremely large net counts

10.16.26

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug that caused a specific Mounting Hole part located at 0,0 to not be listed as a part

10.16.25

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug that caused test pads without single pin parts to not be properly displayed in the Others section, when the ‘List As CONNECTOR’ option for Test Pads has been selected

10.16.24

Improved: Pads CAD Import

  • fixed bug that caused arcs to be drawn as straight lines

Improved: All AOI Test Programmers

  • added ‘SM Parts Only’ option; when selected, only surface mount parts will be included in the program output

Improved: Device Editor

  • updated ‘Merging Devices With Pin Name Changes’ functionality (See: Defining Devices)

10.16.23

Improved: Device Editor

  • fixed bug that caused the device value for certain elements in an RPCK to not register correctly

Improved: Package Editor

  • modified ‘Rename Current Package’ and ‘Rename From Library Alias Match’ functions to allow for renaming two packages to the same name (See: Package Editing)

10.16.21

Improved: ODB++ CAD Import

  • improved algorithm for connecting orphaned pads to include Test Pads over offset Vias

Improved: Plates Editor

  • added 2 options to the Transfer Probes menu: 1) ‘Add Transfer Probe Socket Drill To Plate’, and 2) ‘Add 3070 DRILLED Transfer Probe Socket To Plate’; option 1 adds standard transfer probe socket drill to the plate using the drill diameter for transfer probes set in the Socket Drill Table; option 2 adds transfer probe socket drill loaded from a 3070 fixture file with the designation DRILLED

10.16.18

Improved: BOM Import

  • added Scan recognition of RES value string “0R0”

Improved: IPC 2581 CAD Import

  • fixed bug that caused part of the Paste Mask layer to not load properly

Improved: ODB++ Import

  • fixed bug that caused disconnection of some traces
  • fixed bug that caused rounded rectangle pad shapes to load as rectangles

Improved: Plates Editor

  • added ‘Probes Drill > By Part Number’ to the Select menu

10.16.17

Improved: GenCAD Import

  • added automatic parts rotation that normalizes the GenCAD bottom side part rotation values to the Developer standard

Improved: YESTECH YTV Series AOI Test Programmer

  • added Bottom Flip Rotation option; when set to Horizontal, the bottom parts’ rotation matches the Developer standard rotation, which is HFlip then CCW relative to the package layout; when set to Vertical, the bottom parts’ rotation is VFlip, then CCW

Improved: Plates Editor

  • fixed bug in probe series selection that caused 100 mil selection to select all probes
  • added ‘Select Probes Part Number’ to the Select Menu
  • added ‘All Pads Except Thru-Hole Legs’ to the ‘Counter Sink > Add To Pads’ menu
  • added 2 Choices to ‘Cutouts > Add To Current Part’ and ‘Auto Add Cutouts To Parts’ menus; these choices are ‘Current Plate Only’ and ‘All Plates Penetrated By Part’; the first choice limits any added cutouts to only the currently selected Plate, and the second choice allows cutouts to be added whenever the part height exceeds the bottom of a plate above it
  • modified Manual Pressure Rod Placement to allow placement outside the circuit board boundary after answering Yes to the outside boundary warning

10.16.16

Improved: Plates Editor

  • added ‘Personality Pin Mouse Drill Selection and Editing’ to the standard plates menu; PPin Drill locations can now be selected by a mouse-click or by Area or All On Plate; to select multiple PPin Drills, hold down the shift key when clicking; once the PPin Drill is selected, it can be resized using the ‘Set Selected > Drill Size’ menu option
  • added ability to define the Clearance Drill for a probe tip in the Probe Tip Definition Editor; if the Clearance Drill setting is non-zero for a Part Number, it will be used in lieu of the clearance drill defined by Probe Series; when adding Clearance Drill to a plate, the drill description mouse popup will be ‘PN Probe Tip Clearance’ instead of ‘Probe Series Name Probe Clearance’

Improved: Excellon Router Report

  • fixed bug that caused drill to load incorrectly

10.16.15

Improved: Accel ASCII Import

  • fixed bug that caused non-net Vias to not load properly

10.16.14

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug that caused the listing of single-pin parts for certain package types to not be distributed properly between Node Alternates and Others

Improved: Accel ASCII Import

  • fixed bug that caused drill to load incorrectly

10.16.12

Improved: ODB++ CAD Import

  • fixed bug that caused certain pins to be misplaced during CAD loading

10.16.11

Improved: Package Editor

  • added ‘Rotate Package’ button to the package graphics display toolbar; this button allows the option of rotating the package 90 degrees CW or CCW; component rotation values are calculated Counter Clockwise relative to the orientation of the package; if the package is rotated and ‘Save Package Changes’ is selected, the rotation of all the package components will be recalculated; if the rotated package is saved to the library, it will retain the rotation such that when it is loaded into a new Developer project, the package parts will have rotation relative to the loaded package, which is useful for some testers, in particular AOI and AXI testers, that benefit from consistency in the package definition files; this allows the user to set a rotation standard for each package saved to the library

10.16.10

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug in the Version print that caused invalid NP designations in the BASE Version, when the Base version was not the currently-selected version

Improved: DFT Analysis

  • modified Parts Access reports to calculate percentage coverage using only pins that are connected to other pins; this excludes all NC Nets from the calculation, since they are not used in any way by the circuit board; the Grid and Printed Report headings for the part ‘Pin Count’ was changed to ‘Connected Pins’

Improved: YESTECH AOI Test Programmer

  • modified the Mils output to use 2 decimal places instead of 1
  • added Fiducial Locations to the report list

Improved: Graphical User Interface

  • added ‘Highlight No Test Parts’ and ‘Highlight Selected Parts’ to the main toolbar Parts View options; ‘Highlight No Test Parts’ will highlight all parts with the ‘No Test’ setting selected; ‘Highlight Selected Parts’ will highlight parts selected with the Select Parts functions
  • added a grid to the Current Part view that lists the number and percentages of All Pins, Connected Pins, Probed Connected Pins and DFT Access Connected Pins; for Connected Pins, the percentage listing is relative to All Pins; for Probed and ICT Access Connected pins, the percentage listing is relative to Connected Pins

10.16.9

Improved: Probes Placement Wizard

  • added option to not include Probes in the extracted list with a location of X = 0 and Y = 0

Improved: Takaya Flying Probe Test Programmer

  • modified Analog 2 terminal measurement output to print 3 decimal places for the value instead of 1; the value field now allows a total of 11 characters

Improved: YESTECH Optical Test Programmer

  • added BoardWidth and BoardHeight parameters to the Header
  • added Report Origin selection to allow setting the report origin to either the System (0,0), the Datum, if set, or Mark 1, if set

Improved: Package Editor

  • added feature that enables quick renaming of packages in a Developer project that carries the name of a library package, if a library package alias matches the current package name; a new column, Library Match, has been added to the CB Packages listing; this column contains the name of a package in the library whose name or alias matches the project package name
  • added ‘Rename From Library Alias Match’ menu option to the Library menu, with four choices: the first two are ‘Rename Current Package From Library’ and ‘Rename All Packages From Library’; the first current package option will only be enabled if the current package has a matching Library Alias; if selected, the current package name will be changed to the Library Package name; with the second option, all the CAD Package names will be scanned for a matching Alias in the library and, if found, the Package name will be changed to the Library Package name; when a name is changed from the library, the original CAD name is saved and displayed in the Properties List; if necessary, the original names can be restored with the second two added options, which are used to reset the names back to the original CAD name imported from the CAD file; the choices are ‘Reset Current Package To Original CAD’ and ‘Reset All Renamed Packages To Original CAD Names’

10.16.8

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug that caused TH Leg pads to print incorrectly for some parts

Improved: Plates Excellon Report

  • fixed bug that caused outside cut shapes to not print correctly

10.16.7

Improved: Standard Reports

  • added ‘TestJet Parts List’ report to ‘Circuit Board > Parts’ menu; this report lists all parts with either a TestJet, VTEP or Cover Extend type test; included in the report is the part center location, the side, the package width and height, and the test type

Improved: Plates Design

  • added ‘Save Selected Cutouts’ and ‘Load Selected Cutouts File (.sco)’ to ‘Save and Load’ menu in the Plates Design Toolbar; this allows saving and reloading of selected groups of cutouts into a single file, rather than just a single cutout

Improved: GenCAD Export

  • fixed bug that caused the GenCAD export to fail or be incomplete in the case of some files

10.16.6

Improved: CAD Import Altium PCBDOC

  • fixed bug that caused some PCBDOC files not to load

Improved: Package Editor

  • when setting a package type to Edge Connector, the user is prompted to set the pin sides based on alphanumeric naming (e.g., A1, B1, etc.) or Odd or Even; if both of these options are declined, a new option is prompted for: ‘Setting The Pin Side By Number Range’; in this case, the user is prompted for the Top Side Number Range, e.g., 1-50; all pins numbered within this range are set to the top, all others to the bottom

Improved: Probe Numbering

  • fixed a miscount that occurred when numbering probes with the ‘Ground And Power First’ option selected; the actual probe numbering was not affected, only the reported count

Improved: Print Standard Reports

  • added Pins And Nails XREF report to the ‘Circuit Boards > Circuit Board > Parts Reports’ list; this report lists each part with corresponding pin numbers, pin names, X,Y location, net and associated probe numbers

Pins And Nails XREF Example
Part Q1 (T)

1 B 2.672 0.855 1 NNAME10024 108,109
2 C 2.634 0.943 1 NNAME10010 87,88
3 E 2.596 0.855 1 NNAME10030 102,101

10.16.5

Improved: Takaya Flying Probe Test Programmer

  • fixed bug that caused PJFET and NJFET tests to not be generated when the option ‘FET G-S, G- D Capacitance Test’ is selected
  • added a title bar to the Test Program Controller

10.16.4

Improved: Agilent (Keysight) 3070 Test Programmer

  • added ‘Set NO_PROBE On Side’ to the Options menu; the available choices are ‘Don’t Set NO_PROBE On Side’, ‘Set NO_PROBE On All Top Pads’, and ‘Set NO_PROBE On All Bottom Pads’. ‘Don’t Set NO_PROBE On Side’ is the default option and is reset to this option every time the 3070 Test Programmer is opened; when one of the other options is selected it overrides all other pad access options; if Pads are enabled to be listed on the selected sides, then all pads on the selected side, regardless of other access settings, will be listed as NO_PROBE

10.16.3

Improved: Package Editor

  • fixed bug caused when changing the package size of parts that have overlapping vias under their Surface Mount pins; the package resize routine was not checking for the access status of these types of vias, causing them to be listed as Accessible when they were not

Improved: Plates Design

  • modified the Excellon CN-7 output to sort cutouts by depth when the ‘Prompt For Route Depth’ option is selected

Improved: GenCAD Output

  • fixed bug that caused vias to be listed twice in the GenCAD Routes section

10.15.22

Improved: Takaya Flying Probe Test Programmer

  • added IC Open (TestJet) Tests; options for selecting tested parts include all “Logic” parts, and parts with a designated TestJet test; to set a part as TestJet tested, right-click on the part in either the parts listings treeview, or in the ViewPort graphics view; from the menu, select ‘Part Test > TestJet’; the ‘Sensor Offset’ option for IC Open tests determines how far toward the center of the part the TestJet probe is located; the default is 1000 uM (.03937 in) and the maximum is 2000 uM (.07874 in)
  • added option to the ‘Analog Tests : Add RES Tests To Non-Parallel Caps Below 1uF’; when selected, this will add an additional self-learning resistance test just after each Cap test for isolated Caps with values below 1uF

Improved: ODB++ CAD Import

  • fixed bug that caused some Device pins to be deleted for certain devices during ODB++ file loading

10.15.20

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug in the Print menu that caused problems with file selection

Improved: Takaya Flying Probe Test Programmer

  • modified Power/Ground Shorts test to include all Power To Ground test combinations even if there is a Duplicate Analog Test

Improved: Plates Design

  • modified DXF Output format to use drill type names for the Drill layers; for example, instead of all drills being grouped into a “Drill” layer, they are now grouped by Probe Size and Type; for example, 100 Mil Probe drill points are grouped into layer “100Mil_Probe”; TestJet probe drill points are listed into layer “TestJet_Probes”

Improved: ODB++ CAD Import

  • fixed bug that caused net names to have attribute information, for example, ID=1847, appended to the name

10.15.19

Improved: Agilent (Keysight) 3070 Test Programmer

  • added auto-stagger to part pins that are in the same location on the same layer

Improved: GenCAD Export

  • fixed bug that caused some angled pads to be improperly rotated

10.15.18

Improved: Package Editor

  • added ‘Preferred Pads Reset’ menu to the Edit menu; preferred Pads are pads that have been designated by the CAD designer as either Probed or a Test Point; because these are set by the CAD designer, Developer does not change the setting when package sizes change, specifically when packages are made larger; the ‘Preferred Pads Reset’ menu allows the test engineer to either make changes to the preferred pads access setting either on a package-by-package basis, using then menu selection ‘Set Preferred Pads Under Current Package To No Access’, or globally for all parts, using the menu selection ‘Set Preferred Pads Under All Packages To No Access’; note that the center of the pad must be on or inside the package outline for this setting change to occur; the menu selection ‘Auto Set Preferred Pads Under Resized Parts To No Access’, when checked, will automatically make the changes after a package has been resized and the changes saved

10.15.17

Improved: Agilent (Keysight) 3070 Test Programmer

  • added GP Relay selections to the board file output; GP Relays can be added by right-clicking on a net in the ViewPort and selecting the menu ‘Add GP Relay To Connection’; once added, use the tester treeview and expand the GP Relays node; to add a Reference Net or Card Preference option, right-click on the desired GP Relay node and select the desired option from the menu
  • added ‘Substitute Percent With Underscore’ to the Net Names option table in the Format section

Improved: Device Editor

  • fixed bug that caused the Editor to hang when certain Device Types were loaded

Improved: Circuit Board Summary Report

  • added X75, X50, X39, 115Mil and 125Mil probes to the summary report

10.15.16

Improved: CAD Import – IPC2581 Format

  • fixed errors that caused parts to not be fully populated on the circuit board

Improved: Probes Placement

  • added prompt to placement wizard when all probes are saved to the Circuit Board

Improved: DFT Analysis

  • added ‘Probes Inside CB Keepout’ to the Probes Analysis routine; this lists all probes that are inside any keepout region defined on the circuit board; keepout regions can be defined using the Keepout button on the DFT Analysis Toolbar

10.15.14

Improved: various bug fixes and program improvements

10.15.12

Improved: Takaya Test Programmer

  • modified Value field in Analog tests to only allow 1 digit after the decimal, to prevent column overrun

10.15.11

Improved: BOM Wizard

  • fixed bug that caused JUMPER type parts to not register CLOSED value settings

Improved: Probes Placement

  • added QA X31, 125 Mil to the probe series Resize menu list
  • added 125 Mil – 50 Mil to the Probe Resize Optimization table

Improved: Print Graphics

  • fixed bug that produced print error when selecting certain PDF printers

10.15.10

Improved: ODB++ CAD Import

  • fixed bug that caused net misassignment when ODB++ defines a Card Edge Connector; this is due to the fact that ODB++ does not properly set the pin sides for these connector types

Improved: Screen Color Options Form

  • fixed bug that caused SM layer color settings to be incorrect
  • added functionality to show part outline colors immediately upon setting, rather than after reloading the project

Improved: Agilent (Keysight) i1000 Test Programmer

  • modified Pins report to exclude from the Nails column any probes that are numbered 0

Improved: Probes Placement

  • added QA X31 to the probe series list

10.15.9

Improved: Device Editor

  • added new grid-based Device Pins GUI

Improved: Developer GUI

  • fixed crashing bug caused by dragging the horizontal design view size bar too low

Improved: Revision Manager

  • added check box option to the Revision Manager Toolbar to ‘Include 1 Pin Parts’ in the Parts Analysis reports; when selected, Revision Manager will automatically perform a new Parts Compare Analysis

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug that prevented display of new pin names after editing in the Device or Package Editors

Improved: GenCAD Print

  • added ability to select the Units used in the file output; options include Inches, Mils, cm and mm

Improved: Testability Report

  • reformatted probe count listing by size to include Top, Bottom and Total for each probe size listed; also eliminated listing of probe sizes with zero count

Improved: Schematic Viewer

  • added Net Highlights; when Nets are highlighted using any of the Developer analytical tools, including DFT or Probes Coverage, if the Schematic View is opened the Net names will also be highlighted there, to track the trace highlights in the ViewPort layout view

10.15.7

Improved: Circuit Board Editor

  • added option to generate a circular board outline with 256 vertices centered on Mark1 and a Radius to Mark2; this option is accessed using the Mechanical menu in the Circuit Board tree view, then right-clicking on the Outline node; select the menu item ‘Reset Outline as Circle Centered on Mark1, Radius to Mark2’

Improved: TestSight System Reporter

  • added truncation to the column-delimited reports; if a column string — for example a probe name — is too long and overlaps the start of the next column, it is truncated so there is one space between it and the start of the next column
  • added Delimiter selection options to the reports; the default option is Columns; additional delimiter options are ‘,’ and Tab; note that not all reports are compatible with the comma or tab option and should be left as column-delimited

Improved: BOM Wizard

  • fixed bug that resulted in non-recognition of Part Series designated like “C170-175”

Improved: Device Editor

  • added ability to add internal Jumpers to an RPCK Device

10.15.6

Improved: DFT Analysis

  • fixed bug in Probes Placement analysis section that mischaracterized some probes as having been placed on masked pads

10.15.5

Improved: Agilent (Keysight) 3070 Test Programmer

  • added ‘Edit Pin Map’ and ‘Include Pin Map’ to the Defaults menu; the ‘Edit Pin Map’ option displays the Default Pin Map form for Diodes, Zeners, PCAPs, Transistors and FETs; the ‘Include Pin Map’ option allows the Pin Map section to be included or excluded from the board file

Improved: Schematic Viewer

  • enhanced the Text lookup option to include a drop-down box with all the Schematic text sorted alphabetically, which allows for scrolling to view additional text choices

10.15.4

Improved: Probes Placement

  • added 25Mil, X75, X50, and X39 to the Resize Probe menu
  • fixed bug that did not allow automatic probe resizing down to 25Mil in the probe macro

10.15.3

Improved: System Explorer

  • added Layers menu to the Layers treeview; this is accessed by right-clicking on a layer name in the Circuit Board Data treeview; the Layer menu includes Set Layer Color, Reset Layer Color, Edit Layer, Print Gerber and Format Gerber options; the Print Gerber option allows individual layers to be saved in Gerber format

Improved: CAD Import

  • added Altium PCBDOC to the CAD Import options

Improved: Revision Manager

  • fixed bug that improperly listed a bead as having missing traces

10.15.2

Improved: Isolation Report

  • added ability to output report in Column, Tab or Comma delimitted formats

Improved: CAD Import – Allegro Single File Format

  • fixed bug that caused a large file to hang on load

10.15.1

Improved: Version Editor

  • added Part Number Counts report; this report lists the total number of installed parts (components) for each Part Number in each version, as well as the total number of Non-Pop parts for each part number in each version

10.14.21

Improved: Agilent (Keysight) 5DX Test Programmer

  • fixed bug that resulted in empty Land Patterns and Pad Geometries reports

Improved: BOM Wizard

  • added message after the parser is run and disabled the Merge button if a circuit board does not have any components

10.14.20

Improved: BOM Reporter

  • fixed bug that caused Part Numbers to not be properly reported

10.14.19

Improved: Agilent (Keysight) 3070 Test Programmer

  • modified TestPoint Part Special Pad Access Settings as follows: If the selection is set to NO CHANGE and the TP Part is on a Via, the Via ICT Access settings are used; this also requires that the Override Pad Access Settings option be set to ‘All Pad Access Settings (Default)’; this is used to filter non-DFT Access Vias that also have a TP Part on them

10.14.18

Improved: Device Editor

  • added ‘Merge From Paragon LIBRARY.INI File’ menu item to the Library menu; the Paragon file contains internal Device pinout listings for Package style parts; these pinouts are mapped to the Developer Device definition in the form of Part Elements which connect to external part pins

Improved: DXF Schematic Input

  • added ability to load all the schematic sheets in a directory containing DXF Schematic files; once a single file is selected, the user is prompted as to whether they want to load all the files in the directory

10.14.17

Improved: Corelis Coverage Report Import

  • modified import algorithm to check for valid net names; if the net name in the Corelis report has been changed and does not match any net in the CAD data, the correct net name is obtained by looking up the net in the CAD data using the Part and Pin listed in the Corelis report

Improved: BOM Import

  • improved Part Series Algorithm to recognize part series with trailing non-numeric characters; for example, a part series like U5SV-U8SV will result in part name extractions of U5SV, U6SV, U7SV and U8SV

Improved: Schematic Viewer

  • added a menu bar with ‘Zoom In, Zoom Out’, ‘Fit In Window’ functions; also added edit functions to allow shifting the Schematic text up or down, and to resize the Schematic text
  • modified search for text functions by including a Text box and Next command button: click in the Text box and type in the search text, hit Enter to search, and continue to hit Enter to continue searching; the Next button also searches for the next occurrence of the text; you can also populate the search text box by clicking on a text string in the Schematic ViewPort area

Improved: ODB++ CAD Import

  • fixed bug that caused a mismatch in some trace nets to part pins
  • fixed bug that caused a mistyping of pins as TH on some Surface Mount parts
  • fixed bug that caused oval pad rotation errors

10.14.15

Improved: Agilent (Keysight) 3070 Test Programmer

  • added part Description to the Failure Message option list in the Format tab; the Failure Message in the board file is limited to a maximum of 40 characters

Improved: CAD Import – Load Layers

  • added ‘3070 Plot Gen Files (HPGL)’ to the Circuit Board Load Layers menu; this menu is found by right-clicking on the name of the circuit board in the tree view, and selecting ‘Load > Layers’; when a Plot Gen file (.p) is loaded, it is added to the Circuit Board layer list as a Drawing layer

10.14.14

Improved: CAD Import – Load 3070 Fixture File

  • modified automatic alignment algorithm to move all 3070 Fixture file probe types at the same time, including Probes, Alternates, TestJet, Transfer Probes and Drilled Transfer Probes; this also applies when using the ‘Edit > Probes > Move All’ menu action

Improved: Takaya Flying Probe Programmer

  • added additional filtering to the Duplicate Tests algorithm to remove P2P tests that are also being analog tested

10.14.12

Improved: Takaya Flying Probe Programmer

  • modified Shorts duplicates algorithm to exclude shorts proximity tests on all nets that are also being analog tested

10.14.11

Improved: ODB++ CAD Import

  • modified the Pad Access algorithm to correct masked pad access settings that are incorrectly typed as ‘test_point’ in the Layer file; this resulted in Masked pads being labeled as Preferred

Improved: Takaya Flying Probe Programmer

  • modified the Analog Parts Test comment field to allow 20-character comments as specified in the CA9 manual; this is the current comment field limit and if the part number is listed it can sometimes cause a truncated part number

10.14.10

Improved: DFT Analysis

  • improved clearing algorithm to eliminate residual display readings after choosing ‘File > New’

Improved: Takaya Flying Probe Programmer

  • modified Shorts Duplicates algorithm to remove shorts tests from any two nets that are also being Analog tested for Resistance, Capacitance, Inductance and Voltage (Diodes)

Improved: Agilent (Keysight) 3070 Test Programmer

  • modified PIN_MAP to match the Default Pin Map defined in the Device Editor

10.14.9

Improved: Probes Placement

  • modified ‘Nets Group Pads’ selection to always pick the largest Pad on a net; this option has also been renamed to ‘All Pads (Inc No Net)’; this will place probes on pads that are not on any defined net, as well as pads that are part of either connected or no-connect nets; this is intended as a tool for use on boards that are incomplete or have been rebuilt from Gerber and may not have all of the nets properly defined

Improved: Takaya Flying Probe Programmer

  • improved Test Filtering to exclude Shorts tests that duplicate P2P tests; also removed any shorts test that matches the nets used in a Zero Ohm Resistance measurement

Improved: BOM Import

  • added a field selection for Non-Pop (Non-Populated Parts); this allows a specific field in the source file to be examined for a text value that determines whether a part is listed as Non-populated in the BOM version; the default text value is ‘YES’ but can be changed using the ‘Non-Pop Field Match’ variable found at the bottom of the BOM Wizard form

10.14.7

Improved: Package Editor

  • added Arc editing to the outline editor

Improved: Device Editor

  • fixed bug that generated an error message when editing FET tolerance values

Improved: Takaya Flying Probe Programmer

  • added ‘Hi Fly Zone Programming’; to include Hi Fly Zones in the program, from the Options menu select ‘High Fly Zone > Include Hi Fly Zones’; note that before the High Fly Zones are included, the minimum Hi Fly Part Height must be set using the same menu

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug that caused the wrong HI RES and LO RES values for FETs

Improved: Developer GUI

  • modified ‘Search For Net’ function to automatically center the ViewPort on the first pin in the Pins listing; this occurs only if the Auto Center option is selected in the ViewPort options list

Improved: Revision Manager

  • added Dif XY to the Shifted Pads reports

10.14.6

Improved: CAD Import

  • fixed bug that caused parts to not be loaded on some types of IPC2581 formatted files

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug that caused single-pin TP parts to not be listed in the Connections section of the Board file, even though they were listed as Connectors in the BoardXY file

Improved: Package Editor

  • fixed package rotation issue caused by invalid rotation calculations when saving package outlines to specific parts
  • added the ability to change the rotation of an individual part by setting the Rot value in the Package editor parts listing

10.14.5

Improved: CAD Import

  • added IPC2581B CAD format import

Improved: ODB++ CAD Import

  • modified ODB++ parser to interpret new Version 8 UNITS syntax; this does not affect older format files

10.14.4

Improved: Takaya Flying Probe Programmer

  • added ‘Power/Ground Nets’ and ‘All Nets’ option selections to the Net Opens test; when selecting the Power/Ground Nets option, the Opens test will be restricted to these nets only; if the net class for Power and Ground nets is not set to Fixed and/or Ground, a warning message will be posted in the Options section of the Test Program listing; this test has also been renamed to ‘Net Trace Opens’ to better describe what the test is doing

10.14.3

Improved: Takaya Flying Probe Programmer

  • fixed bug that caused a crash when loading a saved Test Control File

Improved: DFT Analysis

  • added a Package field to the Parts Access reports
  • added the CAD Source File name to all DFT reports; this is available only to projects that have been loaded from CAD using TestSight Developer version 10.14.3 or later

10.14.2

Improved: Takaya Flying Probe Programmer

  • modified default Pad probe speed to be 0 (slightly faster)
  • modified Shorts Find algorithm to filter shorts between two pads (See: Takaya Test Programmer)

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug that caused no_refdes parts to not be listed properly in the boardxy file
  • fixed bug that caused single pin CONN parts to not be listed in the boardxy OTHER Alternates section

 10.14.1

Improved: Package Editor

  • fixed bug that caused incorrect package rotation when the package outline was edited and saved to the project

Improved: TRI Test Programmer

  • modified Type setting in the Nails file to reflect probe sizes; 1 = 100Mil, 2 = 75Mil, 3 = 50Mil, 4 = 39Mil
  • added a Target column to the Nails report

Improved: Takaya Flying Probe Programmer

  • added side selection option to the Board Reference Points table; when the ‘Set Origin’ menu is used, there is an additional menu choice ‘Set Top (or Bottom) Side Only’; if this is not checked, any Reference Point selection will be for both sides; if checked/enabled, the Reference Selection will only affect the selected side

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug that listed Test Pads as Accessible or Preferred even if the Pad Access was set to No Access

Improved: Probes Placement

  • added ‘Per Side’ option to the Probes/Net settings; when selected/enabled, the Min and Max probe counts refer to each side of the board, rather than both sides combined

10.12.20

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug in the conversion of numbers from scientific to engineering notation; 1E-12 was incorrectly converted to 1K due to rounding issues

Improved: Package Editor

  • fixed bug that caused package outline rotation issues after editing and saving a package

10.12.18

Improved: Probes Placement

  • added a sort by pad size; this means that any pad that meets the requirements of the Macro settings and is selected for probe placement will always be the largest available pad

10.12.17

Improved: GenCAD Export

  • fixed bug that caused multiple shapes to be generated for a given package, under certain conditions

Improved: Circuit Board Editor

  • added ‘TestJet Parts’ to the Select Parts menu; added ‘Add Selected Parts To Global Selected Parts’ and ‘Clear Global Selected Parts List’; the Global Selected Parts List is the list that can be shared with Probe Placement (Parts Type) and the Standard Reports generator; the full list can be found in the Circuit Board tree view under ‘Parts > Part Groups > Selected’; parts can also be added to the Global Selected Parts list when in Probe Placement design mode by right-clicking on a part and using the ‘Selected Parts List’ menu

Improved: Takaya Flying Probe Programmer

  • fixed crash bug caused when selecting the ‘Bottom Layer’ option, under certain conditions

Improved: Probes Placement

  • fixed crash bug caused when selecting the ‘Number Probes > Ground And Power First’ option, under certain conditions

10.12.16

Improved: DFT Analysis

  • fixed bug that caused the Critical Nets to not display properly
  • modified the Isolation Tests Interface to include check box display selection

10.12.15

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed issue that caused an unnecessary stagger with some pads
  • fixed bug that caused some single pin parts to be mistyped as to Pad Access
  • modified Part Number Source option to include the Part Number with Pin Library type part tests even when No Part Number is selected

10.12.14

Improved: CAD Import – Create Nets For No Connect Pins

  • fixed bug that caused some traces to be deleted in nets that were converted to No-Connect from the global $NONE$ net

Improved: CAD Import – Pads Power PCB

  • fixed bug that resulted in missing pads on some parts

Improved: Takaya Flying Probe Programmer

  • added filter to test Resistors normally (not as a short) when the Device is set to ‘Allow Zero Ohm’ but has a non-zero ohm value

Improved: Device Editor

  • fixed crash bug caused when trying to save a Device to a directory that is not available
  • added ‘Save To Library’ button; changed ‘Save’ button name to ‘Save To Project’

10.12.12

Improved: CAD Import – Create Nets For No Connect Pins

  • fixed bug that caused some traces to be deleted in nets that were converted to No-Connect from the global $NONE$ net

Improved: CAD Import – Accel ASCII

  • added filter to eliminate illegal single quote marks within quoted fields; these illegal characters cause the bracket levels to be miscounted, resulting in parsing errors of data from some affected items; this can show up as missing parts or other objects

10.12.11

Improved: Takaya Flying Probe Programmer

  • modified the Analog Part test for non-populated parts to self learning (@K *) rather than an Opens test (@K OP)
  • added ‘Add Comment Line For Skipped Tests’ to the options menu; when selected, a comment line will be added for any test that is skipped for being a duplicate or missing nails
  • added option ‘Include Power And Ground Nets’ to both the P2P Connector test and the P2P Logic test; if selected, this will include a P2P test for any combination of Signal, Power and Ground nets that are not the same net

10.12.10

Improved: Takaya Flying Probe Programmer

  • fixed bug that caused the ‘All Parts’ option for the Optical Tests to not show any parts

Improved: DFT Analysis

  • fixed bug that in some cases was finding and listing the wrong part for the ‘Pad Center To Part Edge Spacing’ analysis
  • fixed bug that caused a crash when the Template folder is copied to a new PC
  • in Isolation Tests, modified the ICT parts count to include Top parts with Bottom Access
  • fixed bug that showed the wrong value for the Part Number under certain conditions

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug that triggered crash when saving and loading 3070 Profiles
  • fixed bug that listed Tooling Holes after they had been deleted
  • fixed bug that caused the board outline to be incorrect under certain conditions

10.12.9

Improved: Takaya Flying Probe Programmer

  • fixed bug that caused the Aux reference points to display as large filled circles instead of as a fiducial circle/cross after the project has been saved and reloaded

10.12.8

Improved: Agilent (Keysight) 3070 Test Programmer

  • modified arc segment algorithm to use shorter line segments; this results in a smoother outline when the outline contains arcs that must be converted to line draws
  • fixed bug that misnamed pins with “-” in their name

Improved: CAD Import

  • added Teradyne Double Bump Bead Pads to the Bead Pad recognition algorithm

Improved: Takaya Flying Probe Programmer

  • fixed bug in Optical test that pointed to the wrong side for a part inspection
  • added 0-decimal-place rounding to the Tolerance settings for Analog parts tests; if the rounded value is 0, the tolerance value is obtained from the Default Tolerance table, found using the ‘Edit >Default Tolerance’ menu option
  • changed arrow color for the Origin and Auxiliary Reference Points to Red (Origin), Purple (Aux1) and Green (Aux2); modified the Origin arrow to a large cross

Improved: DFT Analysis

  • added Isolated Parts Analysis; this Analysis looks for Resistors and Capacitors that cannot be measured by ICT because they are in parallel with other parts; the process identifies which part numbers have no test on a given side; if the part number has no ICT test on a side, the ICT test cannot determine if the reel for the part number was loaded correctly; by identifying these part numbers, the CAD designer can choose to put an Isolated part on the side of the board that does not have test access for the part number

 10.12.7

Improved: BOM Reporter

  • modified format to read ‘Part Num’ instead of ‘Device’

Improved: Developer GUI

  • added scaling to the Part and Pin names in the ViewPort; as the screen magnification is increased, the font sizes get larger up to a maximum value

Improved: Takaya Flying Probe Programmer

  • removed Non-Pop parts from the CNET test and added Jumper to the test list; an Open jumper is tested as an Open (OP) Resistor, and a Closed Jumper is tested as a Short (SH)
  • added ‘Test Inductors As Short Below Threshold Value’ option to the Analog Parts tests; when selected, the user will be asked for a Minimum value (in Henries)
  • Transformers (XFMR) are now tested as two shorts tests, if the internal wiring has been defined
  • modified Opens test syntax for Non-Pop parts to ‘Name * Non-Pop * C’ for capacitors and ‘Name * Non-Pop * R’ for resistors

Improved: CAD Import

  • fixed an issue that caused spurious traces to highlight when ‘Create Nets For No Connect Pins’ is selected

10.12.6

Improved: BOM Reporter

  • fixed crashing bug caused by saving and restoring the format from the ‘Save Format’ menu item

Improved: DFT Analysis

  • fixed bug that caused a miscalculation of the number of probes needed for Ground nets based on Progress Track settings for the selected tester

Improved: Revision Manager

  • fixed bug that caused the current net pad listing to inaccurately set the ICT Access setting on the second circuit board in the comparison

Improved: Takaya Flying Probe Programmer

  • modified the sort order for the Analog Part Tests; the Analog Parts are now sorted by Test Type in the following order: 1. Cap (C), 2. Diode (D), 3. Inductor (L), 4. Res (R), 5. Transistor and others; non-populated parts are tested as Open Resistors and listed with the Resistor tests
  • separated Parallel Parts from Analog Parts and made it a separate test
  • changed the Options list for DNET test to: 1. Exclude Parallel Nets, 2. Exclude No Connect Nets, 3. Set Tolerance; when the Exclude Parallel Nets option is set, digital pins that have a signal net that has already been tested on another pin are excluded
  • added warning messages to the Options listing when no Ground or Power nets have been identified
  • modified the CNET test to include pins from all parts rather than just Logic parts

10.12.5

Improved: DXF Drawings Resize

  • added ‘Move And Resize With Markers’ to the Drawings menu; when selected, the user is prompted to click and drag on circuit Board objects; the mouse snap is set to snap to pad centers or drill centers; if both Mouse Down and Mouse Up locations are found, that snap to either a pad or drill, the user is prompted to click and drag on drawing circles; if Mouse Down and Mouse up drawing circles are both found, the user is asked whether the Resize Scale Factor is OK; if it is, the drawing is scaled and moved

Improved: CAD Import – Auto Merge Packages, Devices

  • removed TestSight XML files (tsp, tsc, xml) from being automatically scanned for Library Devices or Packages after load; if the Automatic Merge options are selected, only non-TestSight files are automatically merged with Device and Package libraries after load
  • added ‘Browse To Device Library’ menu item to the ‘File >Library Directory’ menu; this lets the user browse to the desired library instead of entering the path

Improved: Takaya Test Programmer

  • added ability to change the Test Order

10.12.4

Improved: ODB++ CAD Import

  • added ‘PART_NO’ to the selection line for extracting component part numbers

Improved: Unidat CAD Import

  • improved Unidat import and fixed several bugs

Improved: Fiducials

  • added ‘Delete Fiducial’ option when right-clicking on an individual Fiducial in the tree view

Improved: Developer GUI

  • modified ‘Show Circuit Board Instance Numbers’ to use only the circuit board outline when sizing and positioning the numbers for display; this fixes situations where the numbers would display too large and not centered on each circuit board

Improved: Agilent (Keysight) 3070 Test Programmer

  • fixed bug that caused a repeated loop when printing panels with differently-named boards
  • added ‘Panel Tooling’ and ‘Panel Outline’ to the boardxy output

Improved: Takaya Test Programmer

  • fixed offset bug when printing the Bottom side

10.12.3

Improved: Device Editor

  • added ‘Save All Edited Devices to the TestSight XML Library’; this saves any part that has been edited in any way to the current Developer XML Library Directory

Improved: Version Control

  • added Print option to the main menu; the current Version listing can be printed in tab-delimitted or column format

Improved: CAD Import – Create Nets For No Connect Pins

  • improved algorithm for separating NC nets ($NONE$); this fixes the case of Vias sometimes not being connected to the new NC net that has been created for the part-pin

Improved: Agilent (Keysight) 3070 Test Programmer

  • added check to make sure package outlines are closed when printed in the boardxy file

Improved: Takaya Flying Probe Programmer

  • fixed bug that caused the origin to not be changed to the selected values
  • fixed crashing bug caused by loading a new circuit board after first loading another circuit board
  • added an Updated Test Control and several other enhancements

10.12.1

Improved: Agilent (Keysight) 3070 Test Programmer

  • added Version output

Improved: CAD Import – 3070 Board and BoardXY files

  • improved parsing to allow for import of Versions, with accurate Failure Messages and Part Numbers